Applied Materials, Inc. introduced materials, technologies and systems that help chipmakers inte-grate chiplets into advanced 2.5D and 3D packages using hybrid bonding and through-silicon vias (TSVs). The new solutions extend Applied’s industry-leading breadth of technologies for hetero-geneous integration (HI). HI helps semiconductor companies combine chiplets based on a variety of functions, technology nodes and sizes in advanced packages, enabling the combination to perform as a single pro...